Semiconductor Industry - Overview
Semiconductor Materials
Crystal Growth and Wafer Preparation
Contamination Control
Wafer Fabrication - Overview
Process Yields
Epitaxy
Oxidation
Lithography
Reactive Plasma Etching
Film Deposition
Ion Implantation
Metallization
Wafer Test and Evaluation
Assembly and Packaging
Appendix
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Semicon China 2006
March 21-23, 2006
Shanghai New International Expo Center – SNIEC
Shanghai, China
FPD China 2006
March 28-30, 2006
Shanghai Mart
Shanghai, China
Semicon Europa 2006
Exhibition: 4–6 April
Programs & Events: 3–6 April
New Munich Trade Fair Centre
Munich, Germany
Semicon Singapore 2006
9-11 May 2006
Levels 4 and 6
Suntec Singapore International Convention & Exhibition Centre
Singapore
FPD Taiwan 2006
June 14–16, 2006
Taipei World Trade Center
Taipei, Taiwan
Semicon West 2006
July 10-14, 2006
Moscone Center
San Francisco, California, USA
Semicon Taiwan 2006
September 11–13, 2006
Taipei World Trade Center
Taipei, Taiwan
Semi Expo CIS Russia 2006
October 2–4, 2006
Moscow, Russia
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A Brief History of Flipped Chips
Flip Chip Assembly Process
Flip chip tutorial series, covering flip chip assembly processes and applications.
Flip-Chip or Flipchip Assembly
Introduction to Flip Chip What Why How
Solder Bump Flip Chip
Solderless Flip Chip Using Polymer Flip Chip Processes
STUD BUMP FLIP CHIP
Substrates for Flip Chips
THERMOSONIC FLIP CHIP ASSEMBLY
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