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Events

Design, Automation Test in Europe
20-24 April, 2009
Nice, France
Over 960 submissions have been received (over 200 from the USA), and strong contributions from Europe, Asia, South America and Oceania.


10th European Advanced Equipment Control
April 22 - 24, 2009
Hotel Sheraton Catania, Sicily - Italy
This conference 2009 in Catania will review recent technical advancements in order to assure alignment with the needs of integrated circuit manufacturers, semiconductor equipment suppliers, software, sensor, and metrology suppliers. It will also review SEMI standards and consistency with the International Technology Roadmap for Semiconductors.


SPIE Europe - Microtechnologies for the New Millenium
4 - 6 May 2009, Maritim Hotel, Dresden, Germany
Five parallel conferences:
* Smart Sensors, Actuators, and MEMS
* VLSI Circuits and Systems
* Nanotechnology
* Bioengineered and Bioinspired Systems
* Photonic Materials, Devices, and Applications.


Semi Europe Standards
13 -16 May, 2009, Pullman Berlin Schweizerhof
Berlin, Germany
The core element of the SEMI Europe Standards Spring event is the conference "Increased Profitability by Best Practice Sharing in Semiconductor Technology Industries".


The 20th Annual IEEE/SEMI® Advanced Semiconductor Manufacturing Conference ASMC 2009l
May 11-13, 2009 -- Pullman Berlin Schweizerhof, Berlin, Germany
ASMC, now in its 20th year, fills a critical need in our industry by providing the opportunity and the venue for technical managers, hands-on engineers, and other semiconductor industry professionals to network, learn, and share knowledge on new and best-method semiconductor manufacturing practices and concepts. With the dynamic nature of our industry, information sharing across sectors is a vital aspect of innovation and continuous improvement. In May 2009, ASMC and ISSM join forces to bring you even more opportunities to learn the latest in semiconductor manufacturing.


Semicon Russia 2009
June 1-3, 2009
World Trade Center, Moscow, Russia
SEMICON Russia is the only specialized event serving the microelectronics design and manufacturing industry in Russia/CIS.


China International Optoelectronic Exposition (CIOE)
September 6-9, 2009
Shenzhen Convention & Exhibition Center
The China International Optoelectronic Exposition (CIOE) is a worldwide renowned exhibition, which presents the most advanced optoelectronic technologies and innovations. The CIOE 2009 expects around 2,100 exhibitors to showcase products on 70,000 sqm from September 6-9. During the four days, more than 85,000 professional visitors will attend the exhibition. It is supported by all relevant Chinese government bodies, scientific academies, trade associations, and by domestic as well as international key players of the industry.


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  • Semiconductor Industry - Overview

  • History of Semiconductors, Industry Organizations, Conferences, Manufacturing of Solid State Devices, Semiconductor News, The Diode, The Transistor

  • Semiconductor Materials

  • Atomic Structure, The Periodic Table, Conferences on Semiconductor Materials, Electrical Conduction, Carrier Mobility, Conductors, Dielectrics, Doped Semiconductors, Electron and hole conduction, Intrinsic Semiconductors, Semiconductor Production Materials, Compound Semiconducting Materials, Germanium, Silicon

  • Crystal Growth and Wafer Preparation

  • Crystal Growing, Czochralski (CZ) Method, Float-zone Method, Crystalline Materials, Electronic Grade Silicon, Semiconductor Crystal Structure, Crystal Structure Applets and Viewer, Dislocations, Point Defects, Semiconductor Wafers, Silicon Shaping, Wafer Preparation

  • Contamination Control

  • Cleanroom, Contaminants - Chemicals, Metallic Ions, Particles, Contamination Control Companies, Contamination Control Organizations, Contamination Control Products - Buyers Guides, Magazines on Cleanrooms

  • Wafer Fabrication - Overview

  • Basic operations of wafer fabrication, Doping, Heat treatments, Layering, Patterning, Chip Design, Packaging, Regions of a wafer surface, Edge Die, Microchip, Scribe Lines, Wafer Flat, Wafer Sort

  • Process Yields

  • Conferences on Yield and Reliability, Defect and Yield Analysis, Analyzing Semiconductor Failure, Improving yield, Understanding Soft and Firm Errors in Semiconductor Devices, Using bitmap analysis to help identify yield-critical issues in the fab, VLSI chip yield demonstration, Yield Forecasting

  • Epitaxy

  • Conferences on Epitaxy, Fundamentals of Epitaxial Deposition, The Grove Epitaxial Model, Molecular Beam Epitaxy, Silicon on Insulators, Quantum Devices, SOI Wafer Manufacturer, Vapor-Phase Epitaxy

  • Oxidation

  • Field Oxide, Gate Oxide, Oxidation Kinetics, Properties of Oxide, Silicon Oxidation Procedure, Thermal Oxidation, Thermal Silicon Oxide Growth Time Calculator

  • Lithography

  • Lithography Equipment Manufacturer, Photoresist, 10 Process Steps for Photolithography explained together with a short movie, Electron Beam Lithography (EBL), Immersion lithography, Optical Lithography, Semiconductor Tour Photolithography Process

  • Reactive Plasma Etching

  • Dry Etch Equipment Manufacturers, Etching and Pattern Transfer, Etching Overview (Wet and Reactive Ion Etching), Plasma Etch, Plasma-etching processes for ULSI semiconductor circuits

  • Film Deposition

  • Chemical Vapor Deposition (CVD), Electrochemical Deposition, Physical Vapor Deposition (PVD)

  • Ion Implantation

  • Ion Implantation Services, An Introduction to Plasma Source Ion Implantation, Ion Implantation Profile Calculator, Concentrations of Arsenic, Boron, and Phosphorous ions at various substrates, Resistivity & Mobility Calculator for various doping concentrations in silicon, Semiconductors Silicon Device Fabrication Doping (Junction Formation), The Ion Implanter

  • Metallization

  • Metal-Semiconductor Junctions, Metal-Semiconductor Ohmic & Schottky Contacts - Barrier Height and Depletion Width Calculators, Multi Layer Metalliization, Properties of Metallizations Used in Semiconductor Manufacturing, Semiconductor Tour Interconnect - Metallization, Semiconductors Silicon Metallization Alloying and Annealing, Semiconductors Silicon Metallization Backlapping and Backside Metallization

  • Wafer Test and Evaluation

  • Testability and Test Structures, What is Surface Analysis

  • Assembly and Packaging

  • Ball Grid Arrays (BGA), Chip on Board (COB), Chip Scale Package (CSP), Conferences on Device Packaging, Die Bonding, Flip Chip Assembly, Magazines on Packaging, Multi Chip Modules (MCM), Packaging and Bonding Equipment Manufacturers, Packaging Foundries

  • Appendix

  • Semiconductor Abbreviations,,Semiconductor Companies, IC Manufacturers, A D Converters, ASICs, Chip Sets, Controller, CPLDs (Complex Programmable Logic Devices), D A Converter, Data Compression ICs, DC DC Converters, DRAM, DSPs (Digital Signal Processors), EPROM, FLASH Memory, FPGAs (Field Programmable Gate Arrays, Microcontroller, Microprocessor, Network Processors, SRAM, Transceiver, Semiconductor Equipment Manufacturers, Semiconductor Engineering Websites, Semiconductor Glossaries, Dictionaries, Semiconductor related Magazines, Semiconductor Terms, Sourcing and procurement of electronic components, Chip Directories, Product Datasheets, Semiconductor Distributors




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